Academic Institution

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Research Area
Formal modelling
Role
Researcher
Name
Research Area
Formal System Development
Role
Lecturer
Research Area
Cyber-physical systems
Role
Senior Research Fellow
Research Area
UML-B
Role
Dean of the Faculty of Engineering and Physical Sciences
Research Area
Advanced Packaging
Role
Cleanroom Process Integration Engineer
Research Area
Security of Hardware
Role
National Teaching Fellow
Research Area
Microwaves, Antennas, RFID/RFIC, Packaging
Role
UK IC Research Fellow and Proleptic Lecturer

Known Good Dies

Copyright 2022 © Arm and University of Southampton | All Rights Reserved

COILS-C1 65nm SoC with M0 cores in 3D stack

Low-cost 3D die stacking using near-field wireless communication.

This two-tier SoC, fabricated using a TSMC 65nm process, incorporates two Arm Cortex M0 CPU cores in addition to a wireless vertical AHB lite bus for inter-layer power and data transfer. The wireless AHB-Lite bus consists…

Copyright 2022 © Arm and University of Southampton | All Rights Reserved

ICL Experimenter 2018

Taped-out in May 2018, ICL-Experimenter is the first in a series of Arm-ECS research centre test-chips designed to explore wireless 3D integration using inductive coupling links. The chip was fabricated in AMS 0.35um technology with two vertically stacked dies within each IC. This initial pr…

SoClabs

nanoSoC 2023/4

The first tape out of the nanoSoC Cortex M0 based SoC Reference Design. This reference design provides a simple microcontroller system appropriate to host and support the development and evaluation of research IP blocks or subsystems. It supports seamless transition from FPGA to physical silicon …

University of Southampton

Country
United Kingdom of Great Britain and Northern Ireland (the)
Members 29
Projects 18
Articles 5
Contributor since: Wed, 06/30/2021 - 14:50
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Projects

Collaborative
Request of Collaboration
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Use of the Synopsys HAPS® FPGA-based prototyping environment

The Synopsys HAPS® System adds additional capabilities to the FPGA-based prototyping environments SoC Labs can use to support projects. The HAPS® system provides a greater amount of logic resources supporting development of larger SoC designs. It can be used to support multiple projects simultaneously. It is used by many semiconductor companies, including arm for their CPU verification. This collaboration project will use the HAPS® system in SoC Labs projects and share with the community experience in utilising such systems.

Collaborative
Active Project
In partnership with Canada
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Geographical support for Canada

This collaboration project is aimed at providing specific tailored activities to the local geography in Canada by developing local actions that will help stimulate academics and their institutions and the broader semiconductor industry supporters to create new and exciting SoC design projects. 

It may include holding specific local physical meetups where people can exchange design ideas.

It may include utilising locally provided routes to fabrication.

It may include sharing hard to locate test capability across academic institutions.

Reference Design
Active Project
Block Diagram of SRAM chiplet

SRAM Chiplet

On-chip SRAM in ASICs can use a significant area, which equates to a significant cost. One solution is to make the memory off-chip. This project explores the use of Arm IP to create an SRAM chiplet design. The benefit  is that standard memory chiplets can be fabricated at lower cost and used across multiple projects, miminising silicon area to the unique project needs.

Reference Design
Active Project
Nanosoc ADC Integration
SoClabs

ADC Integration in nanoSoC
Rationale

The aim of this project is to define a mixed signal subsystem for the nanosoc reference design. 

In order to interface with real-world signals in a digital SoC, an analog to digital conversion is needed. The mixed signal subsystem should be able to sample analog signals at a regular sampling rate, and transmit a digital representation of this signal to the rest of the nanosoc system.